Frederic Gardes, University of Southampton, UK
Haisheng Rong, Intel, USA
Materials, structures, phenomena and devices that are still in an investigative stage, or that are not yet targeting specific application requirements. Novel materials and material combinations and structures that are enabling new functions or science, and nanophotonic structures. Potential examples include (not limited to) low dimensional structures, amorphous or disordered materials, graphene, complex oxides, photonic crystals, antennas, gratings, subwavelength structures, and plasmonics and their hybrids.
Hon Ki Tsang, Chinese University of Hong Kong, Hong Kong
Patrick Dumais, Huawei Canada, Canada
New device concepts, fabrication processes, and characterization methods for group IV photonic devices. A broad range of device functionalities will be considered, including, but are not limited to, on-chip light sources, high-speed modulation, photo-detection, optical coupling, WDM, filtering and routing, as well as individual devices aimed at sensing. Contributions should focus on device functionalities and innovations rather than photonic systems (such contributions should be submitted to the Electronic-Photonic Integrated Circuits and Systems topic area or, where applicable, to the Applications topic area).
Koji Yamada, National Institute of Advanced Industrial Science and Technology, Japan
Xianshu Luo, Advanced Micro-Foundry, Singapore
Submissions to this topic area should focus on the methods and approaches of integration and system building. This includes electronic and photonic co-integration as well as photonic integration approaches. Examples include hybrid and monolithic integration, interposers, packaging, die/wafer bonding, hetero-epitaxy, etc. Submissions on interconnections, assembly, reliability and testing are also welcome.
Dawn Tan, Singapore University of Technology and Design, Singapore
Zhihong Huang, HP Labs, USA
Submissions to this topic area should be targeted at specific applications (e.g. data center, automotive, bio-medical, free-space communication, LiDAR, imaging, sensing, AI, etc.) The submissions can be related to emerging applications in existing application domains or entirely new application domains.